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Wistron To Assemble Key Apple Iphone Components At A New Plant In India
Taiwan’s major original design manufacturer (ODM), and Apple’s contract manufacturer Wistron Corporation, plans to assemble Printed Circuit Boards (PCBs) i.e. key components that make for about half of the cost of a smartphone, at its new plant in Karnataka, reports Reuters. It might also raise its investments in Karnataka to Rs, 3000 crore. The move highlights Apple’s plans to expand its manufacturing efforts in the country that’s also the second-largest smartphone market globally. For the uninitiated, PCBs or Printed Circuit Boards in a smartphone account for their functionality and performance. It’s the heart of a smartphone and comprises key smartphone components including processors, memory, and wireless chip sets. The smartphone is put together with all these key components
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Taiwan’s major original design manufacturer (ODM), and Apple’s contract manufacturer Wistron Corporation, plans to assemble Printed Circuit Boards (PCBs) i.e. key components that make for about half of the cost of a smartphone, at its new plant in Karnataka, reports Reuters. It might also raise its investments in Karnataka to Rs, 3000 crore. The move highlights Apple’s plans to expand its manufacturing efforts in the country that’s also the second-largest smartphone market globally. For the uninitiated, PCBs or Printed Circuit Boards in a smartphone account for their functionality and performance. It’s the heart of a smartphone and comprises key smartphone components including processors, memory, and wireless chip sets. The smartphone is put together with all these key components